Intel corporation (20240429221). GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

Organization Name

intel corporation

Inventor(s)

Bernd Waidhas of Pettendorf (DE)

Thomas Wagner of Regelsbach (DE)

Georg Seidemann of Landshut (DE)

Nicolas Richaud of Rome (IT)

Manisha Dutta of Munich (DE)

Georgios Dogiamis of Chandler AZ (US)

Harshit Dhakad of Bangalore (IN)

Michael Langenbuch of Munich (DE)

GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

This abstract first appeared for US patent application 20240429221 titled 'GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

Original Abstract Submitted

glass layers and capacitors for use with integrated circuit packages are disclosed. an example integrated circuit (ic) package includes a semiconductor die, a glass layer, and a capacitor electrically coupled to the semiconductor die, at least one side of the capacitor enclosed by the glass layer, the capacitor positioned closer to the glass layer than the semiconductor die is to the glass layer.