Intel corporation (20240429199). METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BONDING
Contents
METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BONDING
Organization Name
Inventor(s)
Bhaskar Jyoti Krishnatreya of Hillsboro OR (US)
Xavier Brun of Hillsboro OR (US)
Johanna Swan of Scottsdale AZ (US)
METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BONDING
This abstract first appeared for US patent application 20240429199 titled 'METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BONDING
Original Abstract Submitted
systems, apparatus, articles of manufacture, and methods are disclosed to self-align batch pick and place die bonding. disclosed is an apparatus comprising a fluid dispensing assembly to dispense first amounts of water onto first hydrophilic regions of a first semiconductor wafer at a first point in time, the first hydrophilic regions having a first arrangement, and dispense second amounts of water onto second hydrophilic regions of a second semiconductor wafer at a second point in time, the second hydrophilic regions having a second arrangement, and a pick-and-place assembly to simultaneously position, at the first point in time, a first batch of dies corresponding to the first arrangement onto the first amounts of water dispensed on the first semiconductor wafer, and simultaneously position, at the second point in time, a second batch of dies corresponding to the second arrangement onto the second amounts of water dispensed on the second semiconductor wafer.
