Intel corporation (20240429173). MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME

Organization Name

intel corporation

Inventor(s)

Henning Braunisch of Chandler AZ (US)

Chia-Pin Chiu of Tempe AZ (US)

Aleksandar Aleksov of Chandler AZ (US)

Hinmeng Au of Phoenix AZ (US)

Stefanie M. Lotz of Phoenix AZ (US)

Johanna M. Swan of Scottsdale AZ (US)

Sujit Sharan of Chandler AZ (US)

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME

This abstract first appeared for US patent application 20240429173 titled 'MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME

Original Abstract Submitted

a multi-chip package includes a substrate () having a first side (), an opposing second side (), and a third side () that extends from the first side to the second side, a first die () attached to the first side of the substrate and a second die () attached to the first side of the substrate, and a bridge () adjacent to the third side of the substrate and attached to the first die and to the second die. no portion of the substrate is underneath the bridge. the bridge creates a connection between the first die and the second die. alternatively, the bridge may be disposed in a cavity () in the substrate or between the substrate and a die layer (). the bridge may constitute an active die and may be attached to the substrate using wirebonds ().