Intel corporation (20240429164). INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRUCTURES
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INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRUCTURES
Organization Name
Inventor(s)
Abhishek A. Sharma of Portland OR (US)
INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRUCTURES
This abstract first appeared for US patent application 20240429164 titled 'INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRUCTURES
Original Abstract Submitted
an example ic device includes a support structure; a device layer over or at least partially in the support structure, the device layer comprising transistors; and an interconnect layer. the device layer is between the support structure and the interconnect layer, and the interconnect layer includes a first conductive line and a second conductive line stacked above the first conductive line. a first end of the first conductive line is substantially aligned with a first end of the second conductive line along a plane perpendicular to the substrate, and a second end of the first conductive line is closer to the plane than a second end of the second conductive line. such an arrangement of conductive lines may be referred to as “flipped staircase.”
