Intel corporation (20240429117). DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC CONSTANTS COUPLED TO A DIE THAT INCLUDES INTEGRATED CIRCUITRY

DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC CONSTANTS COUPLED TO A DIE THAT INCLUDES INTEGRATED CIRCUITRY

Organization Name

intel corporation

Inventor(s)

Harshit Dhakad of Bangalore (IN)

Georgios C. Dogiamis of Chandler AZ (US)

Georg Seidemann of Landshut (DE)

Bernd Waidhas of Pettendorf (DE)

Thomas Wagner of Regelsbach (DE)

Manisha Dutta of Munich (DE)

Michael Langenbuch of Munich (DE)

DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC CONSTANTS COUPLED TO A DIE THAT INCLUDES INTEGRATED CIRCUITRY

This abstract first appeared for US patent application 20240429117 titled 'DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC CONSTANTS COUPLED TO A DIE THAT INCLUDES INTEGRATED CIRCUITRY

Original Abstract Submitted

embodiments herein relate to systems, apparatuses, techniques or processes for reducing the capacitance of a package that includes a die by at least partially surrounding the die within a mold compound and a dielectric material with different dielectric constants. other embodiments may be described and/or claimed.