Intel corporation (20240427232). METHODS AND APPARATUS TO PHOTOLITHOGRAPHICALLY PATTERN MATERIALS IN INTEGRATED CIRCUIT PACKAGES
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METHODS AND APPARATUS TO PHOTOLITHOGRAPHICALLY PATTERN MATERIALS IN INTEGRATED CIRCUIT PACKAGES
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METHODS AND APPARATUS TO PHOTOLITHOGRAPHICALLY PATTERN MATERIALS IN INTEGRATED CIRCUIT PACKAGES
This abstract first appeared for US patent application 20240427232 titled 'METHODS AND APPARATUS TO PHOTOLITHOGRAPHICALLY PATTERN MATERIALS IN INTEGRATED CIRCUIT PACKAGES
Original Abstract Submitted
systems, apparatus, articles of manufacture, and methods to photolithographically pattern materials in integrated circuit packages are disclosed. an example photolithography mask includes: a transparent substrate, and an opaque material supported by the transparent substrate. the opaque material covers a first area of the transparent substrate. the example photolithography mask further includes an optical filter supported by the transparent substrate. the optical filter covers a second area of the transparent substrate. the second area is distinct from the first area. both the opaque material and the optical material are spaced apart from a third area of the transparent substrate
