18705298. 5D CERAMIC HOUSING STRUCTURE AND 5D CERAMIC PROCESSING PROCESS METHOD (Honor Device Co., Ltd.)
Contents
5D CERAMIC HOUSING STRUCTURE AND 5D CERAMIC PROCESSING PROCESS METHOD
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Inventor(s)
5D CERAMIC HOUSING STRUCTURE AND 5D CERAMIC PROCESSING PROCESS METHOD
This abstract first appeared for US patent application 18705298 titled '5D CERAMIC HOUSING STRUCTURE AND 5D CERAMIC PROCESSING PROCESS METHOD
Original Abstract Submitted
This application provides a 5D ceramic housing structure and a 5D ceramic processing process method, to resolve a problem that long processing time of existing CNC and polishing results in high production costs of a housing of an electronic device and low production efficiency. The method includes: obtaining a raw ceramic material, that is, a ceramic powder; performing casting processing on the raw ceramic material to obtain a to-be-sintered green-state ceramic sheet; performing flat ceramic sheet pre-sintering on the green-state ceramic sheet to obtain a sintered product with a shrinkage rate of 18% to 23%; performing 5D heat-bend forming on the sintered product, to enable the sintered product to be further crystallized and deformed by heating to form a ceramic housing; performing fiber adhesion on the ceramic housing; and forming a 5D ceramic housing structure.
