18718967. ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING APPARATUS (FUJI CORPORATION)
Contents
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING APPARATUS
Organization Name
Inventor(s)
Kenji Tsukada of Toyota-shi (JP)
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING APPARATUS
This abstract first appeared for US patent application 18718967 titled 'ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING APPARATUS
Original Abstract Submitted
An electrical circuit forming method includes a wiring forming step of forming a metal wiring on a resin layer, a first application step of applying a conductive fluid to a planned mounting position of an electrode of an electronic component on the metal wiring, a first curing step of curing the conductive fluid, a second application step of applying a curable resin to a planned mounting position of a component main body of the electronic component, a second curing step of semi-curing the curable resin, a mounting step of mounting the electronic component such that the electrode comes into contact with the cured conductive fluid and the component main body comes into contact with the semi-cured curable resin semi-cured, and a third curing step of curing the semi-cured curable resin, after the electronic component is mounted.
