18672638. SYSTEMS AND METHODS FOR CONTACTLESS FORMATION OF TILTED OPTICAL WINDOWS FOR WAFER-LEVEL MICROELECTRONIC DEVICES (Corning Incorporated)

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SYSTEMS AND METHODS FOR CONTACTLESS FORMATION OF TILTED OPTICAL WINDOWS FOR WAFER-LEVEL MICROELECTRONIC DEVICES

Organization Name

Corning Incorporated

Inventor(s)

Thierry Luc Alain Dannoux of Avon (FR)

Timothée Jean Marie Laloy of Chartrettes (FR)

SYSTEMS AND METHODS FOR CONTACTLESS FORMATION OF TILTED OPTICAL WINDOWS FOR WAFER-LEVEL MICROELECTRONIC DEVICES

This abstract first appeared for US patent application 18672638 titled 'SYSTEMS AND METHODS FOR CONTACTLESS FORMATION OF TILTED OPTICAL WINDOWS FOR WAFER-LEVEL MICROELECTRONIC DEVICES



Original Abstract Submitted

Disclosed are various approaches to creating optical windows in glass covers. To create the glass cover with the optical window, a sheet of glass is reformed using a mold that includes a male portion having a first recess and a female portion having a second recess. The female portion of the mold mates with the male portion of the mold. The first recess is configured to form a first gas pocket and the second recess is configured to form a second gas pocket when the male and female portions of the mold are mated, where a cross sectional area of each of the first recess and the second recess is less than 15 square millimeters. A portion of the reformed glass corresponding to the optical window is positioned between the first gas pocket and the second gas pocket.