18646424. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (FUJI ELECTRIC CO., LTD.)
Contents
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kazuma Kawamura of Matsumoto-city (JP)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 18646424 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Original Abstract Submitted
A semiconductor device, including: a stacked substrate; a plurality of semiconductor chips provided on the stacked substrate; an external output terminal; a circuit board configured to electrically connect the plurality semiconductor chips, and to electrically connect the plurality of semiconductor chips to the external output terminal, the circuit board having a first surface and a second surface opposite to each other, the second surface facing the stacked substrate; a sealing resin sealing the stacked substrate and the circuit board; and a plurality of flow velocity control pins attached to the circuit board, at the first surface of the circuit board.
