18703347. DIELECTRIC SHEET, SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD, AND HIGH FREQUENCY PRINTED WIRING BOARD (SUMITOMO ELECTRIC INDUSTRIES, LTD.)

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DIELECTRIC SHEET, SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD, AND HIGH FREQUENCY PRINTED WIRING BOARD

Organization Name

SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor(s)

Shingo Kaimori of Osaka (JP)

Takashi Ninomiya of Osaka (JP)

Yoshio Mezaki of Osaka (JP)

Motohiko Sugiura of Osaka (JP)

Eiko Imazaki of Osaka (JP)

Yasuhiro Okuda of Osaka (JP)

DIELECTRIC SHEET, SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD, AND HIGH FREQUENCY PRINTED WIRING BOARD

This abstract first appeared for US patent application 18703347 titled 'DIELECTRIC SHEET, SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD, AND HIGH FREQUENCY PRINTED WIRING BOARD



Original Abstract Submitted

A dielectric sheet includes a polytetrafluoroethylene and spherical inorganic fillers, wherein a mass ratio of the inorganic fillers to the polytetrafluoroethylene is 1.3 or more, the inorganic fillers have an average particle diameter of 0.3 μm to 4.0 μm, and the inorganic fillers include a silica filler. Part of the polytetrafluoroethylene is present in the form of a plurality of fibrous bodies, and in a SEM image of a surface of the dielectric sheet after a 180-degree peel test, at least part of fibrous bodies among the plurality of fibrous bodies has areas with a thickness of 0.1 μm to 3.0 μm and a length of 50 μm to 5000 μm, and an average space between the areas of the at least part of fibrous bodies is 10 μm or less.