18699944. Method for Producing a Solder Connection and Assembly with a Solder Connection (Siemens Aktiengesellschaft)

From WikiPatents
Revision as of 07:35, 19 December 2024 by Wikipatents (talk | contribs) (Creating a new page)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

Method for Producing a Solder Connection and Assembly with a Solder Connection

Organization Name

Siemens Aktiengesellschaft

Inventor(s)

Christian Walbrecker-baar of Karlsfeld (DE)

Markus Schwarz of Bräunlingen (DE)

Stefan Stegmeier of München (DE)

Method for Producing a Solder Connection and Assembly with a Solder Connection

This abstract first appeared for US patent application 18699944 titled 'Method for Producing a Solder Connection and Assembly with a Solder Connection



Original Abstract Submitted

Various embodiments of the teachings herein include a method of establishing a solder bond between a first solder partner and a second solder partner with a solder medium including a metallic solder material and a multitude of magnetic nanoparticles. An example method includes: a) generating a magnetic alternating field with a magnet coil acting on the solder medium; b) heating the magnetic nanoparticles via the interaction with the magnetic alternating field; and c) melting the metallic solder material owing to heat transfer from the magnetic nanoparticles to the metallic solder material and thereby forming the solder bond between the first solder partner and the second solder partner with molten metallic solder material.

Retrieved from "http://wikipatents.org/index.php?title=18699944._Method_for_Producing_a_Solder_Connection_and_Assembly_with_a_Solder_Connection_(Siemens_Aktiengesellschaft)&oldid=271217"