18385012. PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD ASSEMBLY (Samsung SDI Co., Ltd.)
Contents
PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD ASSEMBLY
Organization Name
Inventor(s)
Woojin Lee of Yongin-si, Gyeonggi-do (KR)
PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD ASSEMBLY
This abstract first appeared for US patent application 18385012 titled 'PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD ASSEMBLY
Original Abstract Submitted
A printed circuit board assembly includes a printed circuit board including a plurality of support holes, a metal frame on which the printed circuit board is supported, and a plurality of bonding portions between the metal frame and the printed circuit board that bond the metal frame and the printed circuit board. The metal frame includes a plate portion opposite the printed circuit board, and a plurality of supports integral with the plate portion, bent and protruding from the plate portion and extending to the printed circuit board, each of the plurality of supports being inserted into each of the plurality of support holes and supporting the printed circuit board.
