18817993. SEMICONDUCTOR DEVICE (DENSO CORPORATION)
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Shingo Tsuchimochi of Kariya-city (JP)
Takanori Kawashima of Kariya-city (JP)
SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 18817993 titled 'SEMICONDUCTOR DEVICE
Original Abstract Submitted
A semiconductor device includes a semiconductor element, a substrate, a bonding material, a main terminal and a plating film. The substrate has an insulating base member, a front surface metal body on a front surface of the insulating base member and electrically connected to a main electrode of the semiconductor element, and a back surface metal body on a back surface of the insulating base member. The bonding material is interposed between the main electrode and the front surface metal body. The main terminal has a solid-state bonded portion bonded to the front surface metal body. The plating film is disposed on the front surface metal body and the main terminal to cover the solid-state bonded portion. The main terminal includes a wide terminal having one solid-state bonded portion and having an overlapping region a width of which is greater than the solid-state bonded portion.