18630326. SEMICONDUCTOR MODULE (DENSO CORPORATION)
Contents
SEMICONDUCTOR MODULE
Organization Name
Inventor(s)
Hiroshi Ishino of Nisshin-shi (JP)
SEMICONDUCTOR MODULE
This abstract first appeared for US patent application 18630326 titled 'SEMICONDUCTOR MODULE
Original Abstract Submitted
A semiconductor module includes a first module and a second module. The first module and the second module are connected to each other by connecting terminals thereof. The first module and the second module are disposed to face each other in a thickness direction of the first module, and a direction of a current path in the first module is opposite to a direction of a current path in the second module.
