18535103. HYBRID MODELING FOR FILM METROLOGY (Tokyo Electron Limited)
Contents
HYBRID MODELING FOR FILM METROLOGY
Organization Name
Inventor(s)
Xinkang Tian of Fremont CA (US)
Francisco Machuca of Fremont CA (US)
HYBRID MODELING FOR FILM METROLOGY
This abstract first appeared for US patent application 18535103 titled 'HYBRID MODELING FOR FILM METROLOGY
Original Abstract Submitted
A method of film thickness modeling includes receiving optical data of a sample having a top layer and at least one underlying layer. First simulation data are obtained by inputting the optical data into a multi-layer model. When a GOF of the first simulation data is below a threshold, a simulated thickness is obtained by inputting the optical data into a top-layer model that is substantially unaffected by the at least one underlying layer. A starting point of the thickness of the multi-layer model is adjusted based on the simulated thickness. Second simulation data are obtained by inputting the optical data into the multi-layer model. When the GOF of the second simulation data is below the threshold, the starting point of the thickness in the multi-layer model is re-adjusted, and third simulation data are obtained by inputting the optical data into the multi-layer model.
