18817491. AIR BRIDGE PREPARATION METHOD, QUANTUM CHIP, AND QUANTUM COMPUTER (Tencent Technology (Shenzhen) Company Limited)
Contents
AIR BRIDGE PREPARATION METHOD, QUANTUM CHIP, AND QUANTUM COMPUTER
Organization Name
Tencent Technology (Shenzhen) Company Limited
Inventor(s)
AIR BRIDGE PREPARATION METHOD, QUANTUM CHIP, AND QUANTUM COMPUTER
This abstract first appeared for US patent application 18817491 titled 'AIR BRIDGE PREPARATION METHOD, QUANTUM CHIP, AND QUANTUM COMPUTER
Original Abstract Submitted
The present disclosure discloses an air bridge manufacturing method, a quantum chip, and a quantum computer, and relates to the field of quantum chip technologies. One method, performed by a photolithography device, includes constructing a bridge support structure for an air bridge on a substrate with a coplanar waveguide by using photoresist; performing ion beam milling processing on the substrate with the bridge support structure to obtain an initial air bridge, the ion beam milling processing being configured for denaturing photoresist on a surface layer of the bridge support structure; and performing light-illumination processing and photoresist removal processing on a photoresist region comprising denatured photoresist in the initial air bridge, to obtain the air bridge. Through embodiments of the present disclosure, a photoresist removal effect can be improved, and a success rate of air bridge manufacturing can be improved.
