18084186. METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIPS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIPS
Organization Name
Inventor(s)
Joonyong Park of Suwon-si (KR)
Sanghoon Song of Suwon-si (KR)
Kyungwook Hwang of Suwon-si (KR)
METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIPS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18084186 titled 'METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIPS
Simplified Explanation
The abstract of the patent application describes a method for transferring semiconductor chips. The method involves several steps, including providing a first substrate, adhering a support substrate to the first substrate, aligning a plurality of semiconductor chips, partially adhering a second substrate to the first substrate, separating the support substrate from the first substrate, and adhering the semiconductor chips to the second substrate by supplying a fluid to the periphery of the second surface of the first substrate and applying pressure.
- The method involves transferring semiconductor chips using a multi-step process.
- A first substrate is provided as a base for the transfer process.
- A support substrate is adhered to the first substrate to provide stability.
- Multiple semiconductor chips are aligned and prepared for transfer.
- A second substrate is partially adhered to the first substrate.
- The support substrate is separated from the first substrate.
- The semiconductor chips are adhered to the second substrate using fluid and pressure.
Potential applications of this technology:
- Semiconductor manufacturing industry
- Electronics manufacturing industry
- Integrated circuit production
Problems solved by this technology:
- Efficient and precise transfer of semiconductor chips
- Minimizing damage during the transfer process
- Ensuring proper alignment and adhesion of the chips
Benefits of this technology:
- Improved productivity in semiconductor manufacturing
- Enhanced quality control in chip transfer process
- Cost savings through reduced chip damage and waste
Original Abstract Submitted
Disclosed are a method of transferring semiconductor chips. The method may include providing a first substrate, adhering a support substrate to the first substrate, supplying and aligning a plurality of semiconductor chips, partially adhering a second substrate to a first surface of the first substrate, separating the support substrate from the first substrate, and adhering the plurality of semiconductor chips to the second substrate by supplying a fluid to a periphery of a second surface of the first substrate and applying a pressure to the second surface.
