18734573. OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED TOGETHER (STMicroelectronics International N.V.)
Contents
OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED TOGETHER
Organization Name
STMicroelectronics International N.V.
Inventor(s)
Florian Perminjat of Saint Romans (FR)
Karine Saxod of Porte De Savoie (FR)
OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED TOGETHER
This abstract first appeared for US patent application 18734573 titled 'OPTICAL PACKAGE COMPRISING A CAP AND A SUPPORT SUBSTRATE CONNECTED TOGETHER
Original Abstract Submitted
An optical package comprising a support substrate including first electrical contacts, a cap fixed to the support substrate by adhesive and comprising second electrical contacts connected to the first electrical contacts by a soldering material, a separation structure disposed between the soldering material and the adhesive
