18680178. SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USING WIRE BONDING (STMicroelectronics International N.V.)
Contents
SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USING WIRE BONDING
Organization Name
STMicroelectronics International N.V.
Inventor(s)
Loic Pierre Louis Renard of Singapore (SG)
SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USING WIRE BONDING
This abstract first appeared for US patent application 18680178 titled 'SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USING WIRE BONDING
Original Abstract Submitted
A semiconductor package with embedded electromagnetic field (EMF) shielding protection using wire bonding is provided. The semiconductor may comprise a plurality of shield wires and signal wires. The shield wires may surround all of a portion of a die to shield the die from EMF. The shield wires and the signal wires may be formed from portions of wire bonds. In manufacturing the semiconductor package these wire bonds may be created connecting to the base and/or the die. The wire bonds may then be broken to form the shield wires and signal wires. These wires may be connected to a ground plane and/or signals pads, which are separated by a dielectric material.
