18816640. PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE (TEXAS INSTRUMENTS INCORPORATED)
Contents
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Anindya Poddar of Sunnyvale CA (US)
Mahmud Chowdhury of The Colony TX (US)
Hau Nguyen of San Jose CA (US)
Masamitsu Matsuura of Beppu (JP)
Ting-Ta Yen of San Jose CA (US)
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 18816640 titled 'PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
Original Abstract Submitted
A method includes forming a stress sensitive component on a first semiconductor die; forming a solder seal on the first semiconductor die, the solder seal extending from a first surface of the first semiconductor die, and surrounding the stress sensitive component, the solder seal having an interior surface that surrounds the stress sensitive component and having an exterior surface facing away from the stress sensitive component; flip chip mounting the first semiconductor die to a first surface of a second semiconductor die, the stress sensitive component facing the first surface of the second semiconductor die; and forming a solder joint between the solder seal and the first surface of the second semiconductor die.
