18086992. CHIP WET TRANSFER APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
CHIP WET TRANSFER APPARATUS
Organization Name
Inventor(s)
Kyungwook Hwang of Suwon-si (KR)
Joonyong Park of Suwon-si (KR)
CHIP WET TRANSFER APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18086992 titled 'CHIP WET TRANSFER APPARATUS
Simplified Explanation
The abstract of the patent application describes a chip wet transfer apparatus that is used to transfer micro-semiconductor chips onto a transfer substrate. The apparatus consists of multiple modules for chip supply and alignment.
- The first chip supply module is responsible for supplying a large number of micro-semiconductor chips to the transfer substrate.
- The first chip alignment module is used to align the large amount of micro-semiconductor chips in a plurality of grooves on the transfer substrate.
- The second chip supply module is designed to supply a smaller amount of micro-semiconductor chips.
- The second chip alignment module aligns the small amount of micro-semiconductor chips.
Potential Applications:
- Semiconductor manufacturing: This technology can be used in the production of micro-semiconductor chips, allowing for efficient and precise transfer onto a substrate.
- Electronics industry: The apparatus can be utilized in the assembly of electronic devices that require the placement of micro-semiconductor chips.
Problems Solved:
- Efficient chip transfer: The apparatus solves the problem of transferring a large number of micro-semiconductor chips onto a substrate in a precise and efficient manner.
- Alignment accuracy: The chip alignment modules ensure accurate alignment of the chips, reducing errors and improving the overall quality of the transfer process.
Benefits:
- Increased productivity: The apparatus enables the transfer of a large number of chips, improving the productivity of chip manufacturing processes.
- Precision and accuracy: The chip alignment modules ensure precise alignment, resulting in higher quality chip transfers.
- Cost-effective: The ability to align and transfer both large and small amounts of chips reduces waste and increases cost-effectiveness in chip manufacturing.
Original Abstract Submitted
A chip wet transfer apparatus includes a first chip supply module configured to supply a large amount of micro-semiconductor chips to a transfer substrate, a first chip alignment module configured to align the large amount of micro-semiconductor chips in a plurality of grooves, a second chip supply module configured to supply a small amount of micro-semiconductor chips, and a second chip alignment module configured to align the small amount of micro-semiconductor chips.
