18389512. POWER MODULE (KIA CORPORATION)
POWER MODULE
Organization Name
Inventor(s)
Jin Myeong Yang of Seongnam-Si (KR)
POWER MODULE
This abstract first appeared for US patent application 18389512 titled 'POWER MODULE
Original Abstract Submitted
Introduced is a power module including a first substrate and a second substrate, a semiconductor chip, and a via spacer electrically connecting the first substrate and the second substrate, wherein the via spacer includes a first portion electrically connected to the first substrate, a second portion electrically connected to the second substrate, and a resistor portion including a resistance value greater than resistance values of the first portion and the second portion and arranged between the first portion and the second portion.
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