18644867. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
This abstract first appeared for US patent application 18644867 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Original Abstract Submitted
A semiconductor package may include a package structure on a redistribution structure. The redistribution structure may include a wiring structure and an insulating structure covering the wiring structure. The package structure may include a semiconductor chip connected to the wiring structure. The insulating structure of the redistribution structure may include a plurality of first insulating layers and a second insulating layer between the plurality of first insulating layers. The plurality of first insulating layers may include at least one of a first conductive line pattern and a first conductive via pattern. The second insulating layer may include a second conductive line pattern overlapping the first conductive line pattern in a vertical direction.
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