Te-Hsuan Peng

Executive Summary

Te-Hsuan Peng is an inventor who has filed 2 patents. Their primary areas of innovation include ELECTRONIC MEMORY DEVICES (1 patents), {using masks} (1 patents), Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics} (1 patents), and they have worked with companies such as Winbond Electronics Corp. (2 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

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List of Technology Areas

• H10B12/31 (ELECTRONIC MEMORY DEVICES): 1 patents
• H01L21/31144 ({using masks}): 1 patents
• H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/76877 ({Thin films associated with contacts of capacitors}): 1 patents
• H01L28/75 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B12/033 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B12/488 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B12/02 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B12/482 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B12/485 (ELECTRONIC MEMORY DEVICES): 1 patents

Companies

List of Companies

• Winbond Electronics Corp.: 2 patents

Collaborators

• Kai Jen (1 collaborations)
• Keng-Ping Lin (1 collaborations)