Taiwan semiconductor manufacturing company, ltd. (20240379804). INTEGRATED LOGIC AND PASSIVE DEVICE STRUCTURE simplified abstract

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INTEGRATED LOGIC AND PASSIVE DEVICE STRUCTURE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chung-Liang Cheng of Hsinchu (TW)

INTEGRATED LOGIC AND PASSIVE DEVICE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379804 titled 'INTEGRATED LOGIC AND PASSIVE DEVICE STRUCTURE

The semiconductor device in this patent application consists of a substrate, a gate all around (GAA) device on top of the substrate, a thin film transistor (TFT) on top of the GAA device, and a passive device on top of the TFT. These components are stacked on each other and partially overlap.

  • The device includes a via that connects the passive device to one layer of the GAA device, with a middle portion of the via spaced apart from the TFT and the passive device.
  • The via allows for efficient electrical connections between different layers of the semiconductor device.
  • The use of a gate all around (GAA) device provides enhanced control over the flow of current in the device.
  • The thin film transistor (TFT) offers high performance and efficiency in the operation of the semiconductor device.
  • The passive device plays a crucial role in the overall functionality of the semiconductor device.

Potential Applications: - This technology can be used in the development of advanced electronic devices such as smartphones, tablets, and computers. - It can also be applied in the manufacturing of sensors, displays, and other electronic components.

Problems Solved: - The technology addresses the need for improved connectivity and performance in semiconductor devices. - It solves the challenge of integrating multiple components in a compact and efficient manner.

Benefits: - Enhanced electrical connectivity and performance. - Compact design for space-efficient electronic devices. - Improved overall functionality and reliability.

Commercial Applications: - The technology can be utilized by semiconductor manufacturers to produce high-performance electronic devices for consumer and industrial markets.

Questions about the technology: 1. How does the via in this semiconductor device improve electrical connections between different components? 2. What advantages does the gate all around (GAA) device offer compared to other types of semiconductor devices?


Original Abstract Submitted

a semiconductor device includes a substrate, a gate all around (gaa) device overlying the substrate, and a thin film transistor (tft) overlying the gaa device, and a passive device overlying the tft. the substrate, the gaa device, the tft, and the passive device is subsequently stacked on each other and at least partially overlap with each other. a via includes a first end, a second end, and a middle portion of the via that is located between the first end and the second end of the via. the first end of the via is connected to the passive device and the second end of the via is connected to one layer of the gaa device. the middle portion of the via is laterally spaced apart from the tft and the passive device.

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