Taiwan semiconductor manufacturing company, ltd. (20240379754). SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING simplified abstract
Contents
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Tzu-Ging Lin of Kaohsiung City (TW)
Shun-Hui Yang of Taoyuan County (TW)
Chun-Liang Lai of Hsinchu City (TW)
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379754 titled 'SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING
The patent application describes devices with metal structures formed with seams and methods of fabrication.
- Metal plug formed with a seam on the top surface
- Film deposited over the top surface of the metal plug, partially filling the seam
- Etching the film from over the metal plug, leaving the film in the seam
Potential Applications: - Manufacturing of electronic devices - Aerospace industry for structural components - Automotive industry for lightweight materials
Problems Solved: - Enhancing structural integrity of metal structures - Improving the efficiency of fabrication processes
Benefits: - Increased durability of metal structures - Cost-effective fabrication methods - Enhanced performance of devices
Commercial Applications: Title: "Innovative Metal Fabrication Techniques for Enhanced Structural Integrity" This technology can be utilized in industries such as electronics, aerospace, and automotive for the production of high-quality metal structures with improved strength and durability.
Questions about the technology: 1. How does the use of seams in metal structures improve their overall performance?
- The seams help distribute stress more evenly, enhancing the structural integrity of the metal components.
2. What are the potential cost savings associated with this innovative fabrication method?
- The method can lead to cost-effective production processes by reducing material waste and improving efficiency.
Original Abstract Submitted
devices with metal structures formed with seams and methods of fabrication are provided. an exemplary method includes forming a metal plug having a top surface formed with a seam; depositing a film over the top surface of the metal plug and at least partially filling the seam; and etching the film from over the metal plug, wherein the film remains in the seam.
