Taiwan semiconductor manufacturing company, ltd. (20240379747). GATE AIR SPACER PROTECTION DURING SOURCE/DRAIN VIA HOLE ETCHING simplified abstract

GATE AIR SPACER PROTECTION DURING SOURCE/DRAIN VIA HOLE ETCHING

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Kuo-Chiang Tsai of Hsinchu City (TW)

Jyh-Huei Chen of Hsinchu City (TW)

GATE AIR SPACER PROTECTION DURING SOURCE/DRAIN VIA HOLE ETCHING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379747 titled 'GATE AIR SPACER PROTECTION DURING SOURCE/DRAIN VIA HOLE ETCHING

The semiconductor device described in the abstract includes a gate over a substrate, a source/drain in the substrate, a conductive contact over the source/drain, an air spacer between the gate and the conductive contact, a first component over the gate, and a second component over the air spacer, with the second component being different from the first component.

• The device features a unique configuration with multiple components stacked in a specific order.
• The air spacer provides insulation between the gate and the conductive contact.
• The different components serve distinct functions within the semiconductor device.
• This design may lead to improved performance and efficiency in electronic devices.
• The innovation could potentially enhance the overall functionality of semiconductor devices.

Potential Applications: - This technology could be applied in the development of advanced integrated circuits. - It may find use in the manufacturing of high-performance electronic devices. - The design could be beneficial for applications requiring precise control of electrical signals.

Problems Solved: - Addresses the need for improved insulation and performance in semiconductor devices. - Offers a novel approach to component stacking in electronic devices.

Benefits: - Enhanced performance and efficiency in electronic devices. - Potential for increased functionality and reliability. - Opens up possibilities for new advancements in semiconductor technology.

Commercial Applications: Title: Innovative Semiconductor Device Design for Enhanced Performance This technology could have commercial applications in the semiconductor industry, particularly in the development of high-performance electronic devices. The unique configuration of components offers potential benefits for manufacturers looking to improve the efficiency and functionality of their products.

Questions about Semiconductor Device Design: 1. How does the air spacer contribute to the overall performance of the semiconductor device? The air spacer provides insulation between the gate and the conductive contact, preventing interference and improving efficiency.

2. What advantages does the stacking of multiple components offer in semiconductor devices? Stacking multiple components allows for a more compact design and potentially enhanced functionality in electronic devices.

Original Abstract Submitted

a semiconductor device includes a gate disposed over a substrate. a source/drain is disposed in the substrate. a conductive contact is disposed over the source/drain. an air spacer is disposed between the gate and the conductive contact. a first component is disposed over the gate. a second component is disposed over the air spacer. the second component is different from the first component.