Taiwan semiconductor manufacturing company, ltd. (20240379746). THERMOELECTRIC COOLING OF SEMICONDUCTOR DEVICES simplified abstract
Contents
THERMOELECTRIC COOLING OF SEMICONDUCTOR DEVICES
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Jen-Yuan Chang of Hsinchu City (TW)
Jheng-Hong Jiang of Hsinchu (TW)
Chin-Chou Liu of Hsinchu County (TW)
THERMOELECTRIC COOLING OF SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379746 titled 'THERMOELECTRIC COOLING OF SEMICONDUCTOR DEVICES
The patent application describes a method of embedding a thermoelectric module in a semiconductor substrate, where the module consists of two semiconductor structures with different dopants connected electrically.
- The thermoelectric module extends through the thickness of the semiconductor substrate.
- The first and second semiconductor structures have dopants of different conductivity types.
- The innovation enables the generation of electricity from temperature differentials within the semiconductor structure.
Potential Applications: - Energy harvesting in semiconductor devices. - Power generation in electronic devices. - Thermal management in integrated circuits.
Problems Solved: - Efficient energy harvesting from temperature differentials. - Enhanced power generation capabilities in semiconductor devices.
Benefits: - Improved energy efficiency. - Enhanced power generation capabilities. - Better thermal management in electronic devices.
Commercial Applications: Title: Semiconductor Thermoelectric Modules for Energy Harvesting This technology can be used in various electronic devices to improve energy efficiency and power generation capabilities, leading to potential cost savings and environmental benefits.
Questions about Semiconductor Thermoelectric Modules: 1. How does embedding a thermoelectric module in a semiconductor substrate improve energy efficiency? 2. What are the potential commercial applications of this technology in the electronics industry?
Frequently Updated Research: Researchers are continually exploring ways to enhance the efficiency and performance of thermoelectric modules in semiconductor devices. Stay updated on the latest advancements in this field for potential future applications and improvements.
Original Abstract Submitted
a method of forming a semiconductor structure including a thermoelectric module embedded in the semiconductor substrate, where the thermoelectric module includes a first semiconductor structure electrically connected to a second semiconductor structure, where a bottom portion of thermoelectric module extends through a thickness of the semiconductor substrate, and where the first semiconductor structure and the second semiconductor structure include dopants of different conductivity types.
