Taiwan semiconductor manufacturing company, ltd. (20240379716). STILTED PAD STRUCTURE simplified abstract
Contents
STILTED PAD STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Sin-Yao Huang of Tainan City (TW)
Hung-Ling Shih of Tainan City (TW)
Kuo-Ming Wu of Zhubei City (TW)
Hung-Wen Hsu of Tainan City (TW)
STILTED PAD STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379716 titled 'STILTED PAD STRUCTURE
Simplified Explanation: The patent application describes an integrated circuit (IC) chip with a stilted pad structure that includes a wire, a semiconductor substrate, and a trench isolation structure. The stilted pad structure is inset into the backside of the semiconductor substrate and comprises a pad body and a pad protrusion.
- The IC chip features a stilted pad structure with a pad body and a pad protrusion.
- The pad protrusion extends towards a wire through the semiconductor substrate and trench isolation structure.
- The pad body overlies a portion of the semiconductor substrate and is separated from the trench isolation structure.
Key Features and Innovation:
- Stilted pad structure with pad body and pad protrusion.
- Integration of wire, semiconductor substrate, and trench isolation structure.
- Design allows for efficient signal transmission and isolation.
Potential Applications:
- Semiconductor manufacturing
- Integrated circuit design
- Electronic devices
Problems Solved:
- Improved signal transmission
- Enhanced isolation between components
- Efficient use of space on IC chips
Benefits:
- Higher performance in integrated circuits
- Increased reliability of electronic devices
- Space-saving design for compact devices
Commercial Applications: Potential commercial applications include the production of high-performance electronic devices, such as smartphones, tablets, and computers. The technology can also be utilized in the automotive industry for advanced driver assistance systems and in the healthcare sector for medical devices.
Questions about Stilted Pad Structure: 1. What are the main components of the stilted pad structure in the IC chip? 2. How does the pad protrusion contribute to the functionality of the stilted pad structure?
Frequently Updated Research: Ongoing research in semiconductor manufacturing and integrated circuit design may lead to further advancements in stilted pad structures for improved performance and efficiency in electronic devices.
Original Abstract Submitted
various embodiments of the present disclosure are directed towards an integrated circuit (ic) chip comprising a stilted pad structure. a wire underlies a semiconductor substrate on a frontside of the semiconductor substrate. further, a trench isolation structure extends into the frontside of the semiconductor substrate. the stilted pad structure is inset into a backside of the semiconductor substrate that is opposite the frontside. the stilted pad structure comprises a pad body and a pad protrusion. the pad protrusion underlies the pad body and protrudes from the pad body, through a portion of the semiconductor substrate and the trench isolation structure, towards the wire. the pad body overlies the portion of the semiconductor substrate and is separated from the trench isolation structure by the portion of the semiconductor substrate.
