Taiwan semiconductor manufacturing company, ltd. (20240379664). CHECKERBOARD DUMMY DESIGN FOR EPITAXIAL OPEN RATIO simplified abstract

CHECKERBOARD DUMMY DESIGN FOR EPITAXIAL OPEN RATIO

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Yu-Chang Jong of Hsinchu City (TW)

Yi-Huan Chen of Hsin Chu City (TW)

Chien-Chih Chou of New Taipei City (TW)

Tsung-Chieh Tsai of Chu-Bei City (TW)

Szu-Hsien Liu of Zhubei City (TW)

Huan-Chih Yuan of Zhubei City (TW)

Jhu-Min Song of Nantou City (TW)

CHECKERBOARD DUMMY DESIGN FOR EPITAXIAL OPEN RATIO - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379664 titled 'CHECKERBOARD DUMMY DESIGN FOR EPITAXIAL OPEN RATIO

Simplified Explanation: The integrated chip structure described in the patent application includes different types of transistor devices with varying source/drain regions and gate structures. Additionally, a dummy region with dummy structures is present, which also includes epitaxial regions.

• The integrated chip structure consists of a substrate divided into a first device region and a second device region.
• The first device region contains transistor devices with epitaxial source/drain regions and a first gate structure.
• The second device region houses transistor devices with implanted source/drain regions and a second gate structure.
• A dummy region with dummy structures, including epitaxial regions, is also part of the chip structure.

Key Features and Innovation:

• Integration of different types of transistor devices within the same chip structure.
• Inclusion of a dummy region with dummy structures for improved performance.
• Use of epitaxial regions in both the transistor devices and dummy structures.

Potential Applications: The technology described in the patent application could be applied in:

• Semiconductor manufacturing
• Integrated circuit design
• Electronic device production

Problems Solved:

• Enhancing the performance and efficiency of integrated chip structures.
• Optimizing the layout and design of transistor devices.
• Improving the overall functionality of electronic devices.

Benefits:

• Increased speed and reliability of semiconductor devices.
• Enhanced integration capabilities for complex circuits.
• Potential cost savings in manufacturing processes.

Commercial Applications: Potential commercial applications of this technology could include:

• Consumer electronics
• Automotive electronics
• Telecommunications equipment

Prior Art: Readers interested in prior art related to this technology may explore research papers, patents, and industry publications in the field of semiconductor device manufacturing and integrated circuit design.

Frequently Updated Research: Stay informed about the latest advancements in semiconductor technology, integrated circuit design, and materials science to understand the evolving landscape of chip structures.

Questions about Integrated Chip Structure: 1. What are the key advantages of integrating different types of transistor devices in a single chip structure? 2. How does the inclusion of a dummy region with dummy structures contribute to the overall performance of the integrated chip structure?

Original Abstract Submitted

some embodiments relate to an integrated chip structure. the integrated chip structure includes a substrate having a first device region and a second device region. a plurality of first transistor devices are disposed in the first device region and respectively include epitaxial source/drain regions disposed on opposing sides of a first gate structure. the epitaxial source/drain regions have an epitaxial material. a plurality of second transistor devices are disposed in the second device region and respectively include implanted source/drain regions disposed on opposing sides of a second gate structure. a dummy region includes one or more dummy structures. the one or more dummy structures have dummy epitaxial regions including the epitaxial material.