Taiwan semiconductor manufacturing company, ltd. (20240379656). INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE simplified abstract

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INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Yi Ching Ong of Hsinchu (TW)

Kuen-Yi Chen of Hsinchu (TW)

Yi-Hsuan Chen of Taoyuan City (TW)

Kuo-Ching Huang of Hsinchu City (TW)

Harry-Hak-Lay Chuang of Zhubei City (TW)

INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379656 titled 'INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE

The present disclosure pertains to an integrated chip with multiple layers over a substrate, including a first metal layer, a second metal layer, an ionic crystal layer, and a metal oxide layer. These layers are positioned over a transistor device along the substrate.

  • The integrated chip includes a first metal layer, a second metal layer, an ionic crystal layer, and a metal oxide layer.
  • These layers are arranged over a substrate, with a transistor device positioned underneath.
  • The combination of layers provides unique properties and functionalities to the integrated chip.
  • The integration of different materials enhances the performance and efficiency of the chip.
  • The design allows for improved conductivity and stability of the chip.

Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in the automotive industry for advanced vehicle systems. - The integrated chip may find applications in medical devices and industrial equipment.

Problems Solved: - Enhances the performance and efficiency of electronic devices. - Improves conductivity and stability of integrated circuits. - Enables the development of more advanced and reliable technologies.

Benefits: - Increased functionality and performance of electronic devices. - Enhanced conductivity and stability of integrated circuits. - Potential for developing more advanced and efficient technologies.

Commercial Applications: Title: Advanced Integrated Chip Technology for Enhanced Electronic Devices This technology has significant commercial potential in the consumer electronics market, automotive industry, medical device sector, and industrial applications. It can lead to the development of more advanced and efficient electronic devices, providing a competitive edge to companies in these sectors.

Questions about Integrated Chip Technology: 1. How does the integration of multiple layers enhance the performance of the chip? 2. What are the potential applications of this technology in different industries?

Frequently Updated Research: Stay updated on the latest advancements in integrated chip technology, including research on new materials, design improvements, and applications in various industries.


Original Abstract Submitted

the present disclosure relates to an integrated chip including a first metal layer over a substrate. a second metal layer is over the first metal layer. an ionic crystal layer is between the first metal layer and the second metal layer. a metal oxide layer is between the first metal layer and the second metal layer. the first metal layer, the second metal layer, the ionic crystal layer, and the metal oxide layer are over a transistor device that is arranged along the substrate.