Taiwan semiconductor manufacturing company, ltd. (20240379645). Semiconductor Device Package and Methods of Manufacture simplified abstract
Contents
Semiconductor Device Package and Methods of Manufacture
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Semiconductor Device Package and Methods of Manufacture - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379645 titled 'Semiconductor Device Package and Methods of Manufacture
The method described in the abstract involves the formation of a redistribution structure on a carrier substrate, connecting a first interconnect structure to the redistribution structure, attaching a first semiconductor device to the first interconnect structure, removing the carrier substrate, and attaching a second semiconductor device to the redistribution structure.
- Formation of redistribution structure on a carrier substrate
- Connection of first interconnect structure to redistribution structure
- Attachment of first semiconductor device to first interconnect structure
- Removal of carrier substrate
- Attachment of second semiconductor device to redistribution structure
Potential Applications: - Semiconductor packaging - Integrated circuit manufacturing
Problems Solved: - Efficient connection of semiconductor devices - Space-saving design in semiconductor packaging
Benefits: - Improved performance in semiconductor devices - Enhanced reliability in integrated circuits
Commercial Applications: Title: Advanced Semiconductor Packaging Technology This technology can be used in the production of high-performance electronic devices, such as smartphones, computers, and automotive electronics. The market implications include faster and more reliable devices for consumers.
Questions about the technology: 1. How does this technology improve the performance of semiconductor devices? 2. What are the potential cost savings associated with this innovative packaging method?
Frequently Updated Research: Researchers are constantly exploring new materials and techniques to further enhance the efficiency and reliability of semiconductor packaging technologies. Stay updated on the latest advancements in the field for potential future applications.
Original Abstract Submitted
a method includes forming a redistribution structure on a carrier substrate, coupling a first side of a first interconnect structure to a first side of the redistribution structure using first conductive connectors, where the first interconnect structure includes a core substrate, where the first interconnect structure includes second conductive connectors on a second side of the first interconnect structure opposite the first side of the first interconnect structure, coupling a first semiconductor device to the second side of the first interconnect structure using the second conductive connectors, removing the carrier substrate, and coupling a second semiconductor device to a second side of the redistribution structure using third conductive connectors, where the second side of the redistribution structure is opposite the first side of the redistribution structure.
