Taiwan semiconductor manufacturing company, ltd. (20240379638). INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Jiun Yi Wu of Zhongli City (TW)
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379638 titled 'INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
The abstract of the patent application describes a package that includes a first substrate, a second substrate, and an interposer frame between them. The first substrate has a connection pad on one face, the second substrate has a connection pad on the other face, and the interposer frame separates the two substrates with through substrate holes aligned with the connection pads for soldering.
- The package consists of a first substrate, a second substrate, and an interposer frame.
- The first substrate has a connection pad on one face, while the second substrate has a connection pad on the other face.
- An interposer frame separates the first and second substrates and includes through substrate holes aligned with the connection pads.
- Solder is used to electrically connect the first connection pad to the second connection pad through the through substrate holes.
- This design allows for efficient electrical connections between the substrates.
Potential Applications: - This technology can be used in electronic devices where compact and efficient packaging is required. - It can be applied in industries such as telecommunications, computing, and consumer electronics.
Problems Solved: - Provides a solution for creating reliable electrical connections between substrates in a compact package. - Ensures efficient signal transmission between components in electronic devices.
Benefits: - Enables compact and efficient packaging of electronic components. - Facilitates reliable electrical connections between substrates. - Improves signal transmission efficiency in electronic devices.
Commercial Applications: - This technology can be utilized in the development of smartphones, tablets, laptops, and other electronic devices requiring compact packaging. - It can also be beneficial in the manufacturing of high-performance computing systems and communication devices.
Questions about the technology: 1. How does the interposer frame contribute to the efficiency of electrical connections in the package? 2. What are the potential challenges in implementing this packaging design in mass production?
Original Abstract Submitted
some embodiments relate to a package. the package includes a first substrate, a second substrate, and an interposer frame between the first and second substrates. the first substrate has a first connection pad disposed on a first face thereof, and the second substrate has a second connection pad disposed on a second face thereof. the interposer frame is arranged between the first and second faces and generally separates the first substrate from the second substrate. the interposer frame includes a plurality of through substrate holes (tshs) which pass entirely through the interposer frame. a tsh is aligned with the first and second connection pads, and solder extends through the tsh to electrically connect the first connection pad to the second connection pad.
