Taiwan semiconductor manufacturing company, ltd. (20240379637). THREE-DIMENSION LARGE SYSTEM INTEGRATION simplified abstract
Contents
THREE-DIMENSION LARGE SYSTEM INTEGRATION
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
THREE-DIMENSION LARGE SYSTEM INTEGRATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379637 titled 'THREE-DIMENSION LARGE SYSTEM INTEGRATION
The abstract of the patent application describes a package that includes a building block with a device die, an interposer bonded with the device die, and a first encapsulant encapsulating the device die. The package also includes a second encapsulant encapsulating the building block, an interconnect structure with redistribution lines electrically coupling to the device die, and a power module over the interconnect structure.
- The package consists of a building block with a device die and an interposer bonded together.
- The device die is encapsulated by a first encapsulant.
- A second encapsulant encapsulates the entire building block.
- An interconnect structure with redistribution lines electrically connects to the device die.
- A power module is placed over the interconnect structure and is electrically coupled to the building block through the interconnect structure.
Potential Applications: - This technology can be used in the manufacturing of advanced electronic devices. - It can be applied in the development of high-performance computing systems. - The package design can be utilized in the production of power modules for various industries.
Problems Solved: - Provides a compact and efficient packaging solution for electronic components. - Ensures proper electrical connections between different parts of the package. - Enhances the overall performance and reliability of the electronic devices.
Benefits: - Improved thermal management due to the encapsulation of the device die. - Enhanced electrical connectivity through the interconnect structure. - Compact design leading to space-saving in electronic systems.
Commercial Applications: "Advanced Electronic Packaging Technology for High-Performance Computing Systems"
Questions about the technology: 1. How does the interconnect structure improve the electrical connectivity within the package? 2. What are the potential cost-saving benefits of using this advanced packaging technology in electronic devices?
Original Abstract Submitted
a package includes a building block. the building block includes a device die, an interposer bonded with the device die, and a first encapsulant encapsulating the device die therein. the package further includes a second encapsulant encapsulating the building block therein, and an interconnect structure over the second encapsulant. the interconnect structure has redistribution lines electrically coupling to the device die. a power module is over the interconnect structure. the power module is electrically coupled to the building block through the interconnect structure.
