Taiwan semiconductor manufacturing company, ltd. (20240379616). DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING simplified abstract
Contents
DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Yun Chen Teng of New Taipei City (TW)
Chen-Fong Tsai of Hsinchu (TW)
Jyh-Cherng Sheu of Hsinchu (TW)
Huicheng Chang of Tainan City (TW)
DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379616 titled 'DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING
Simplified Explanation:
The method described in the patent application involves placing two wafers on separate stages and pushing the center of one wafer to contact the other. This creates a bonding wave that reduces the gap between the stages.
- The method involves placing wafers on stages and creating a bonding wave by pushing the center of one wafer to contact the other.
- The bonding wave propagates from the center to the edge of the wafers, reducing the gap between the stages.
Potential Applications: This technology could be used in semiconductor manufacturing processes where bonding of wafers is required.
Problems Solved: This technology addresses the need for a method to bond wafers together efficiently and effectively.
Benefits: The method described in the patent application allows for a reduction in the stage gap between wafers, leading to improved bonding results.
Commercial Applications: Title: Wafer Bonding Method for Semiconductor Manufacturing This technology could be utilized in the semiconductor industry for wafer bonding processes, potentially improving production efficiency and quality.
Prior Art: Readers interested in prior art related to this technology could explore research papers and patents in the field of semiconductor manufacturing processes.
Frequently Updated Research: There may be ongoing research in the semiconductor industry related to wafer bonding techniques and technologies that could be relevant to this method.
Questions about Wafer Bonding Method for Semiconductor Manufacturing: 1. What are the key advantages of using this wafer bonding method in semiconductor manufacturing? 2. How does this method compare to traditional wafer bonding techniques in terms of efficiency and effectiveness?
Original Abstract Submitted
a method includes placing a first wafer on a first wafer stage, placing a second wafer on a second wafer stage, and pushing a center portion of the first wafer to contact the second wafer. a bonding wave propagates from the center portion to edge portions of the first wafer and the second wafer. when the bonding wave propagates from the center portion to the edge portions of the first wafer and the second wafer, a stage gap between the top wafer stage and the bottom wafer stage is reduced.
