Taiwan semiconductor manufacturing company, ltd. (20240379606). METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract
Contents
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Po-Han Wang of Hsinchu City (TW)
Hung-Jui Kuo of Hsinchu City (TW)
Shih-Peng Tai of Hsinchu County (TW)
Yu-Hsiang Hu of Hsinchu City (TW)
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379606 titled 'METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes multiple semiconductor devices, an insulating layer, and a redistribution layer. The insulating layer is positioned over the semiconductor devices, while the redistribution layer is placed over the insulating layer and is electrically connected to the semiconductor devices. The redistribution layer contains a conductive line portion and features a stitching zone. Additionally, the insulating layer has a ridge structure on a surface away from the semiconductor devices, located within the stitching zone.
- The semiconductor package comprises multiple semiconductor devices, an insulating layer, and a redistribution layer.
- The insulating layer is positioned over the semiconductor devices, while the redistribution layer is placed over the insulating layer and is electrically connected to the semiconductor devices.
- The redistribution layer includes a conductive line portion and features a stitching zone.
- The insulating layer has a ridge structure on a surface away from the semiconductor devices, positioned within the stitching zone.
Potential Applications: - This technology can be utilized in the manufacturing of advanced semiconductor packages for various electronic devices. - It can be applied in the development of high-performance computing systems and mobile devices.
Problems Solved: - Enhances the electrical connectivity and performance of semiconductor devices. - Provides improved insulation and protection for the semiconductor components.
Benefits: - Increased efficiency and reliability of semiconductor packages. - Enhanced electrical connectivity and performance. - Improved protection and insulation for semiconductor devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be commercialized in the semiconductor industry for the production of high-performance electronic devices such as smartphones, laptops, and servers. It can also be used in the automotive industry for advanced driver-assistance systems and electric vehicles.
Questions about Semiconductor Packaging Technology: 1. How does the ridge structure on the insulating layer contribute to the overall performance of the semiconductor package? 2. What are the potential market implications of implementing this advanced semiconductor packaging technology in various electronic devices?
Original Abstract Submitted
a semiconductor package including a plurality of semiconductor devices, an insulating layer, and a redistribution layer is provided. the insulating layer is disposed over the semiconductor device. the redistribution layer is disposed over the insulating layer and electrically connected to the semiconductor device. the redistribution layer includes a conductive line portion. the semiconductor package has a stitching zone, and the insulating layer has a ridge structure on a surface away from the semiconductor device and positioned within the stitching zone.
