Taiwan semiconductor manufacturing company, ltd. (20240379601). INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chien-Yuan Huang of Hsinchu (TW)

Shih-Chang Ku of Taipei City (TW)

Chuei-Tang Wang of Taichung City (TW)

Chen-Hua Yu of Hsinchu City (TW)

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379601 titled 'INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

The integrated circuit package described in the patent application consists of two dies bonded together. The first die contains die pads, bonding pads, conductive vias, and thermal vias, while the second die includes bonding pads.

• The first die features die pads over a device, bonding pads over the die pads, a conductive via connecting a die pad to a bonding pad, and a thermal via connecting two specific pads while being electrically insulated from others.
• The second die has bonding pads that connect to the bonding pads on the first die.

Potential Applications: - This technology can be used in various electronic devices that require integrated circuit packages with enhanced connectivity and thermal management.

Problems Solved: - Improved electrical connections and thermal dissipation within integrated circuit packages.

Benefits: - Enhanced performance and reliability of electronic devices. - Better heat dissipation leading to increased longevity of components.

Commercial Applications: - This technology can be applied in the manufacturing of smartphones, tablets, computers, and other electronic devices where compact and efficient integrated circuit packages are essential.

Questions about the Technology: 1. How does the thermal via in the integrated circuit package improve heat dissipation? 2. What are the specific advantages of having conductive vias in the package design?

Frequently Updated Research: - Stay updated on advancements in integrated circuit packaging technologies to ensure the latest innovations are incorporated into future designs.

Original Abstract Submitted

an integrated circuit package includes first and second dies bonded to each other. the first die includes first die pads over a first device, first bonding pads over the first die pads, a first conductive via disposed between and electrically connected to a first one of the first die pads and a first one of the first bonding pads, and a first thermal via disposed between a second one of the first die pads and a second one of the first bonding pads and electrically insulated from the second one of the first die pads or the second one of the first bonding pads. the second die includes second bonding pads. the first one of the first bonding pads is connected to a first one of the second bonding pads. the second one of the first bonding pads is connected to a second one of the second bonding pads.