Taiwan semiconductor manufacturing company, ltd. (20240379598). BONDING STRUCTURE AND METHOD OF FORMING SAME simplified abstract

BONDING STRUCTURE AND METHOD OF FORMING SAME

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Ming-Fa Chen of Taichung City (TW)

Sung-Feng Yeh of Taipei City (TW)

Hsien-Wei Chen of Hsinchu (TW)

Jie Chen of New Taipei City (TW)

BONDING STRUCTURE AND METHOD OF FORMING SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379598 titled 'BONDING STRUCTURE AND METHOD OF FORMING SAME

The abstract of the patent application describes a package consisting of two dies, one with a first metallization layer, first bond pad vias, and first bond pads, and the other with second bond pads that are bonded to the first bond pads.

• The package includes a first die with a first metallization layer.
• There are one or more first bond pad vias on the first metallization layer.
• A first barrier layer extends across the first metallization layer between each first bond pad via and the first metallization layer.
• One or more first bond pads are located on the first bond pad vias.
• A second barrier layer extends across each first bond pad via between a first bond pad and the first bond pad via.
• The second die includes one or more second bond pads, with a second bond pad being bonded to a first bond pad of the first die.

Potential Applications: - Semiconductor packaging - Integrated circuits - Microelectronics

Problems Solved: - Improved bonding between dies - Enhanced electrical connectivity - Increased reliability in electronic devices

Benefits: - Enhanced performance of electronic devices - Increased durability of semiconductor packages - Improved signal transmission efficiency

Commercial Applications: - Semiconductor industry - Electronics manufacturing sector - Research and development in microelectronics

Questions about the technology: 1. How does the first barrier layer enhance the performance of the package? 2. What are the specific advantages of bonding the second bond pads to the first bond pads in this configuration?

Original Abstract Submitted

a package includes a first die that includes a first metallization layer, one or more first bond pad vias on the first metallization layer, wherein a first barrier layer extends across the first metallization layer between each first bond pad via and the first metallization layer, and one or more first bond pads on the one or more first bond pad vias, wherein a second barrier layer extends across each first bond pad via between a first bond pad and the first bond pad via, and a second die including one or more second bond pads, wherein a second bond pad is bonded to a first bond pad of the first die.