Taiwan semiconductor manufacturing company, ltd. (20240379594). BOND PAD WITH ENHANCED RELIABILITY simplified abstract
Contents
BOND PAD WITH ENHANCED RELIABILITY
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Tzu-Hsuan Yeh of Taoyuan City (TW)
Chern-Yow Hsu of Chu-Bei City (TW)
BOND PAD WITH ENHANCED RELIABILITY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379594 titled 'BOND PAD WITH ENHANCED RELIABILITY
The present disclosure pertains to an integrated chip with a conductive feature over a dielectric structure on a substrate, with layers that etch at different rates when exposed to different etchants.
- Integrated chip with conductive feature and dielectric structure
- First layer on peripheral regions of conductive feature
- Second layer with different etching rates exposed to different etchants
- Additional conductive feature extending through layers to contact main feature
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit design
Problems Solved: - Enhanced etching control - Improved conductivity - Better integration in chip design
Benefits: - Higher efficiency in chip manufacturing - Increased performance in electronic devices - Enhanced reliability in integrated circuits
Commercial Applications: Title: Advanced Integrated Chip Technology for Enhanced Performance Description: This technology can be used in various electronic devices, such as smartphones, computers, and IoT devices, to improve their performance and reliability in a cost-effective manner.
Questions about Integrated Chip Technology: 1. How does the different etching rates of the layers contribute to the overall functionality of the integrated chip? 2. What are the specific advantages of having an additional conductive feature in the design of the integrated chip?
Original Abstract Submitted
the present disclosure, in some embodiments, relates to an integrated chip. the integrated chip includes a conductive feature disposed over a dielectric structure on a substrate. a first layer is arranged on peripheral regions of the conductive feature. a second layer has a bottommost surface arranged on the first layer. the second layer includes a material that etches at a higher rate than the first layer when exposed to a first etchant and that etches at a lower rate than the first layer when exposed to a second etchant. an additional conductive feature extends through the first layer and the second layer to contact the conductive feature.
