Taiwan semiconductor manufacturing company, ltd. (20240379592). Transmission Line Structures for Three-Dimensional Integrated Circuit and the Methods Thereof simplified abstract
Contents
Transmission Line Structures for Three-Dimensional Integrated Circuit and the Methods Thereof
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsiu-Ying Cho of Hsin-Chu (TW)
Transmission Line Structures for Three-Dimensional Integrated Circuit and the Methods Thereof - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379592 titled 'Transmission Line Structures for Three-Dimensional Integrated Circuit and the Methods Thereof
Simplified Explanation: The patent application describes a device with a dielectric layer containing a transmission line structure. The structure includes metal lines and dielectric islands with varying dielectric constants.
- Dielectric layer with transmission line structure
- Metal lines and dielectric islands
- Varying dielectric constants
- Alignment of dielectric islands in different regions
- Potential for improved signal transmission efficiency
Key Features and Innovation: - Utilization of dielectric islands with higher dielectric constants for enhanced performance - Precise alignment of dielectric islands in different regions for optimized signal transmission - Integration of metal lines within the dielectric layer for improved conductivity
Potential Applications: - High-frequency communication systems - Microwave technology - Signal processing applications
Problems Solved: - Signal loss in transmission lines - Inefficiencies in high-frequency signal transmission - Interference in communication systems
Benefits: - Improved signal transmission efficiency - Enhanced performance in high-frequency applications - Reduction of signal loss and interference
Commercial Applications: Title: Enhanced Signal Transmission Technology for High-Frequency Applications This technology can be applied in the development of advanced communication systems, microwave devices, and signal processing equipment. It has the potential to revolutionize high-frequency technology and improve overall system performance in various commercial applications.
Prior Art: Prior research in the field of high-frequency signal transmission and dielectric materials may provide insights into similar technologies or approaches.
Frequently Updated Research: Ongoing research in dielectric materials, signal processing, and high-frequency communication systems may offer new developments and advancements related to this technology.
Questions about the Technology: 1. How does the alignment of dielectric islands impact signal transmission efficiency? 2. What are the potential challenges in integrating dielectric islands with different dielectric constants in the transmission line structure?
Original Abstract Submitted
an exemplary device includes a dielectric layer and a transmission line structure disposed in the dielectric layer. the transmission line structure includes a first metal line disposed between a second metal line and a third metal line. dielectric islands are disposed in a first region and a second region of the dielectric layer. the first region of the dielectric layer is between the first metal line and the second metal line. the second region of the dielectric layer is between the first metal line and the third metal line. a dielectric constant of the dielectric islands is greater than a dielectric constant of the dielectric layer. the dielectric islands may be doped sections of the dielectric layer. in some embodiments, the dielectric islands in the first region are aligned with the dielectric islands in the second region along a direction perpendicular to a lengthwise direction of the first metal line.
