Taiwan semiconductor manufacturing company, ltd. (20240379588). GUARD RING STRUCTURE simplified abstract
Contents
GUARD RING STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Min-Feng Ku of Hsinchu City (TW)
Yao-Chun Chuang of Hsinchu City (TW)
Cheng-Chien Li of Hsinchu City (TW)
GUARD RING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379588 titled 'GUARD RING STRUCTURE
The abstract of this patent application describes an integrated circuit structure with a guard ring structure that includes multiple layers, a via structure, and a top metal feature.
- The IC structure includes a substrate, an interconnect structure, a guard ring structure, a via structure, and a top metal feature.
- The guard ring structure consists of multiple layers, each with a lower and upper portion, creating a smooth inner surface.
- The via structure extends vertically through the guard ring structure, providing electrical connections.
- The top metal feature is in direct contact with the guard ring structure and the via structure.
- The alignment of the sidewalls of the guard ring layers ensures a precise and efficient design.
Potential Applications: - This technology can be used in the manufacturing of advanced integrated circuits for various electronic devices. - It can improve the performance and reliability of IC structures in high-speed applications.
Problems Solved: - Enhances the electrical connectivity and signal integrity of IC structures. - Provides better protection against electromagnetic interference.
Benefits: - Improved reliability and performance of integrated circuits. - Enhanced signal integrity and reduced interference. - Efficient design for high-speed applications.
Commercial Applications: Guard ring structures like the one described in this patent application can be utilized in the production of advanced electronic devices such as smartphones, computers, and networking equipment.
Questions about Guard Ring Structures: 1. How does the alignment of the guard ring layers contribute to the overall performance of the IC structure? 2. What are the specific advantages of having a guard ring structure in an integrated circuit design?
Original Abstract Submitted
integrated circuit (ic) structures and methods for forming the same are provided. an ic structure according to the present disclosure includes a substrate, an interconnect structure over the substrate, a guard ring structure disposed in the interconnect structure, a via structure vertically extending through the guard ring structure, and a top metal feature disposed directly over and in contact with the guard ring structure and the via structure. the guard ring structure includes a plurality of guard ring layers. each of the plurality of guard ring layers includes a lower portion and an upper portion disposed over the lower portion. sidewalls of the lower portions and upper portions of the plurality of guard ring layers facing toward the via structure are substantially vertically aligned to form a smooth inner surface of the guard ring structure.
