Taiwan semiconductor manufacturing company, ltd. (20240379569). MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract
Contents
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chih-Hang Tung of Hsinchu (TW)
Chen-Hua Yu of Hsinchu City (TW)
Tung-Liang Shao of Hsinchu (TW)
Su-Chun Yang of Hsinchu County (TW)
Wen-Lin Shih of Taipei City (TW)
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379569 titled 'MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
The abstract of the patent application describes a manufacturing method for a semiconductor device.
- An electrical insulating and thermal conductive layer is formed over a semiconductor substrate.
- A dielectric structure is formed over the electrical insulating and thermal conductive layer, with the former having a higher thermal conductivity.
- An opening is created in the dielectric structure, extending through both the dielectric structure and the electrical insulating and thermal conductive layer.
- A circuit layer is formed in the dielectric structure, filling the opening.
Potential Applications: - This technology can be applied in the manufacturing of various semiconductor devices such as integrated circuits, sensors, and transistors.
Problems Solved: - Enhances thermal conductivity in semiconductor devices. - Improves overall performance and efficiency of the devices.
Benefits: - Increased thermal conductivity. - Enhanced performance and reliability of semiconductor devices.
Commercial Applications: - This technology can be utilized in the production of high-performance electronic devices for industries such as telecommunications, automotive, and consumer electronics.
Questions about the technology: 1. How does the higher thermal conductivity of the electrical insulating and thermal conductive layer benefit the semiconductor device?
- The higher thermal conductivity helps in dissipating heat more efficiently, leading to improved performance and reliability of the device.
2. What role does the dielectric structure play in the overall functionality of the semiconductor device?
- The dielectric structure provides insulation and structural support for the circuit layer, ensuring proper functioning of the device.
Original Abstract Submitted
a manufacturing method of a semiconductor device includes the following steps. an electrical insulating and thermal conductive layer is formed over a semiconductor substrate. a dielectric structure is formed over the electrical insulating and thermal conductive layer, wherein a thermal conductivity of the electrical insulating and thermal conductive layer is substantially greater than a thermal conductivity of the dielectric structure. an opening is formed in the dielectric structure, wherein the opening extending through the dielectric structure and the electrical insulating and thermal conductive layer. a circuit layer is formed in the dielectric structure, wherein the circuit layer fills the opening.
