Taiwan semiconductor manufacturing company, ltd. (20240379554). BACK SIDE SIGNAL ROUTING IN A CIRCUIT WITH A RELAY CELL simplified abstract

BACK SIDE SIGNAL ROUTING IN A CIRCUIT WITH A RELAY CELL

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Shih-Wei Peng of Hsinchu City (TW)

Wei-Cheng Lin of Taichung City (TW)

Jiann-Tyng Tzeng of Hsin-Chu (TW)

BACK SIDE SIGNAL ROUTING IN A CIRCUIT WITH A RELAY CELL - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379554 titled 'BACK SIDE SIGNAL ROUTING IN A CIRCUIT WITH A RELAY CELL

Simplified Explanation: The patent application describes apparatus and methods for routing a data signal on the back side of a semiconductor device. It involves a semiconductor cell structure with a dummy device region, metal layer, dielectric layer, inner metal, vias, and physical coupling between the inner metal and the dummy device region.

• The semiconductor cell structure includes a dummy device region at the front side.
• A metal layer with multiple metal lines is located at the back side.
• A dielectric layer separates the dummy device region and the metal layer.
• An inner metal is within the dielectric layer.
• At least one first via electrically connects the inner metal to the metal lines at the back side.
• At least one second via physically couples the inner metal to the dummy device region at the front side.

Key Features and Innovation:

• Back side routing of a data signal in a semiconductor device.
• Use of dummy device region, metal layer, dielectric layer, inner metal, and vias for signal transmission.
• Physical coupling between inner metal and dummy device region for improved signal integrity.

Potential Applications:

• Semiconductor manufacturing
• Integrated circuit design
• Signal processing technologies

Problems Solved:

• Efficient routing of data signals in semiconductor devices
• Improved signal integrity and transmission speed
• Reduction of signal interference and crosstalk

Benefits:

• Enhanced performance of semiconductor devices
• Higher data transmission speeds
• Reduced signal loss and interference

Commercial Applications: Potential commercial applications include:

• High-speed data processing systems
• Telecommunications equipment
• Consumer electronics devices

Prior Art: Prior art related to back side routing of data signals in semiconductor devices can be found in research papers, patents, and industry publications related to semiconductor manufacturing processes and integrated circuit design.

Frequently Updated Research: Researchers are constantly exploring new methods and materials for improving signal routing and transmission in semiconductor devices. Stay updated on the latest advancements in semiconductor technology to leverage the benefits of back side routing for data signals.

Questions about Back Side Routing of Data Signals: 1. How does back side routing of data signals in semiconductor devices differ from traditional front side routing? 2. What are the key challenges in implementing back side routing for data signals in semiconductor devices?

Original Abstract Submitted

apparatus and methods for back side routing a data signal in a semiconductor device are described. in one example, a described semiconductor cell structure includes: a dummy device region at a front side of the semiconductor cell structure; a metal layer including a plurality of metal lines at a back side of the semiconductor cell structure; a dielectric layer formed between the dummy device region and the metal layer; an inner metal disposed within the dielectric layer; at least one first via that is formed through the dielectric layer and electrically connects the inner metal to the plurality of metal lines at the back side; and at least one second via that is formed in the dielectric layer and physically coupled between the inner metal and the dummy device region at the front side.