Taiwan semiconductor manufacturing company, ltd. (20240379552). LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS simplified abstract
Contents
LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chung-Hsing Wang of Hsinchu (TW)
Meng-Xiang Lee of Hsinchu (TW)
LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379552 titled 'LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS
Simplified Explanation: The patent application discloses various layouts for conductive interconnects in the conductor layers of an integrated circuit, with some interconnects included in a power delivery system. The interconnects in the first conductor layer are arranged orthogonally, while those in the second layer are arranged non-orthogonally. Transition conductor layers with conductive stripes connect interconnects between the first and second layers.
- Key Features and Innovation:
- Various layouts for conductive interconnects in an integrated circuit. - Inclusion of interconnects in a power delivery system. - Orthogonal arrangement of interconnects in the first conductor layer. - Non-orthogonal arrangement of interconnects in the second conductor layer. - Transition conductor layers with conductive stripes for interconnect connection.
Potential Applications: This technology can be applied in the semiconductor industry for the design and fabrication of integrated circuits, particularly in optimizing power delivery systems within circuits.
Problems Solved: - Efficient arrangement of conductive interconnects in different conductor layers. - Improved power delivery system within integrated circuits. - Enhanced connectivity between interconnects in different layers.
Benefits: - Enhanced performance and efficiency of integrated circuits. - Better power delivery and connectivity within circuits. - Potential for more compact and optimized circuit designs.
Commercial Applications: Potential commercial applications include the semiconductor industry for the development of advanced integrated circuits with optimized power delivery systems, leading to improved performance and efficiency in electronic devices.
Questions about Conductive Interconnects: 1. How do the conductive interconnect layouts in different conductor layers impact the overall performance of an integrated circuit? 2. What are the advantages of using transition conductor layers with conductive stripes for connecting interconnects between different conductor layers?
Original Abstract Submitted
various layouts for conductive interconnects in the conductor layers in an integrated circuit are disclosed. some or all of the conductive interconnects are included in a power delivery system. in general, the conductive interconnects in a first conductor layer are arranged according to an orthogonal layout and the conductive interconnects in a second conductor layer are arranged according to a non-orthogonal layout. conductive stripes in a transition conductor layer positioned between the first and the second conductor layers electrically connect the conductive interconnects in the first conductor layer to the conductive interconnects in the second conductor layer.
