Taiwan semiconductor manufacturing company, ltd. (20240379548). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract
Contents
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Kuang-Wei Cheng of Hsinchu (TW)
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379548 titled 'SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
The semiconductor device described in the abstract includes a patterned wiring layer above a semiconductor substrate, with a first insulating passivation layer between adjacent wiring portions and a second insulating passivation layer on top.
- The semiconductor device features a patterned wiring layer with separated wiring portions.
- A first insulating passivation layer is placed between adjacent wiring portions.
- The first insulating passivation layer has a flat surface in the region between adjacent wiring portions.
- A second insulating passivation layer is added on top of the first insulating passivation layer.
- There are no voids in the region between adjacent wiring lines.
Potential Applications: - Integrated circuits - Semiconductor manufacturing - Electronics industry
Problems Solved: - Improved insulation between wiring portions - Enhanced reliability of semiconductor devices
Benefits: - Reduced risk of short circuits - Increased durability of semiconductor devices - Enhanced performance of integrated circuits
Commercial Applications: Title: Advanced Semiconductor Devices for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, leading to improved efficiency and reliability in various industries such as telecommunications, consumer electronics, and automotive.
Questions about the technology: 1. How does the placement of the insulating passivation layers impact the performance of the semiconductor device?
- The insulating passivation layers help prevent short circuits and enhance the reliability of the device.
2. What are the potential cost implications of implementing this technology in semiconductor manufacturing?
- While initial costs may increase slightly, the long-term benefits of improved device performance and reliability outweigh the expenses.
Original Abstract Submitted
a semiconductor device includes a patterned wiring layer disposed above a semiconductor substrate, the patterned wiring layer including a plurality of wiring portions, and adjacent wiring portions being separated from each other. the semiconductor device also includes a first insulating passivation layer disposed over the wiring portions in a region between adjacent wiring portions, the first insulating passivation layer having a horizontal surface in the region between adjacent wiring portions. the semiconductor device further includes a second insulating passivation layer disposed on the first insulating passivation layer. the first insulating passivation layer and the second insulating passivation layer do not have a void in the region between adjacent wiring lines.
