Taiwan semiconductor manufacturing company, ltd. (20240379543). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract

From WikiPatents
Revision as of 01:41, 25 November 2024 by Wikipatents (talk | contribs) (Creating a new page)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Hung-Jen Hsu of Hsinchu City (TW)

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379543 titled 'SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

The abstract of the patent application describes a process for manufacturing a semiconductor device by identifying a course between two conductive pads and forming a conductive trace perpendicular to the course.

  • The process involves identifying a course between a first and second conductive pad.
  • A first conductive trace is formed crossing the identified course.
  • The first conductive trace extends perpendicular to the course.

Potential Applications: - Semiconductor manufacturing - Electronics industry

Problems Solved: - Efficient manufacturing process for semiconductor devices - Precise alignment of conductive traces

Benefits: - Improved accuracy in semiconductor device production - Enhanced performance of electronic components

Commercial Applications: Title: Semiconductor Device Manufacturing Process This technology can be used in the production of various electronic devices, leading to more reliable and efficient products in the market. The innovation can have significant implications for the semiconductor industry, improving the quality and performance of electronic components.

Questions about Semiconductor Device Manufacturing Process: 1. How does the identified course between conductive pads contribute to the manufacturing process?

  - The identified course helps in determining the minimum distance between the conductive pads, ensuring proper alignment during production.

2. What advantages does forming a conductive trace perpendicular to the course offer in semiconductor device manufacturing?

  - Forming a conductive trace perpendicular to the course allows for precise placement and connection of components, enhancing the overall quality of the semiconductor device.


Original Abstract Submitted

a semiconductor device is manufactured by a process including identifying a course extending between a minimum distance between a first perimeter of a first conductive pad and a second perimeter of a second conductive pad. the process can include forming a first conductive trace crossing the identified course. the first conductive trace can extend along a direction perpendicular to the course.