Taiwan semiconductor manufacturing company, ltd. (20240379536). METHOD OF FORMING PACKAGE STRUCTURE simplified abstract
Contents
METHOD OF FORMING PACKAGE STRUCTURE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Yi-Wen Wu of New Taipei City (TW)
Hung-Jui Kuo of Hsinchu City (TW)
Ming-Che Ho of Tainan City (TW)
METHOD OF FORMING PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379536 titled 'METHOD OF FORMING PACKAGE STRUCTURE
The patent application describes a package structure with a die, an electrically connecting structure, an insulating protrusion, a conductive structure, and a dielectric structure.
- The die is placed on the electrically connecting structure within a die attach region.
- An insulating protrusion is located in the peripheral region surrounding the die attach region, extending in the thickness direction of the die.
- A conductive structure encapsulates the insulating protrusion and is electrically coupled to the electrically connecting structure and the die.
- A dielectric structure encapsulates the die and the conductive structure.
Potential Applications: - This technology could be used in semiconductor packaging for electronic devices. - It may find applications in the automotive industry for sensors and control units.
Problems Solved: - Provides improved electrical connectivity and insulation for the die. - Enhances the reliability and performance of electronic components.
Benefits: - Increased durability and longevity of electronic devices. - Enhanced electrical performance and signal integrity.
Commercial Applications: - Semiconductor manufacturing companies can utilize this technology to improve the quality of their products. - Electronics manufacturers can benefit from the enhanced reliability and performance of their devices.
Questions about the technology: 1. How does this innovation improve the reliability of electronic components? 2. What are the potential cost implications of implementing this technology in semiconductor packaging?
Frequently Updated Research: - Stay updated on advancements in semiconductor packaging technologies for potential improvements in this area.
Original Abstract Submitted
provided is a package structure including a die; an electrically connecting structure having a die attach region and a peripheral region surrounding the die attach region, wherein the die is disposed on the electrically connecting structure within the die attach region; an insulating protrusion disposed in the peripheral region and extending in a thickness direction of the die; a conductive structure disposed on the electrically connecting structure and encapsulating the insulating protrusion, wherein the conductive structure is electrically coupled to the electrically connecting structure and the die; and a dielectric structure disposed on the electrically connecting structure and encapsulating the die and the conductive structure.
