Taiwan semiconductor manufacturing company, ltd. (20240379535). SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME simplified abstract

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Chung-Shi Liu of Hsinchu (TW)

Chien-Hsun Lee of Chu-tung Town (TW)

Jiun Yi Wu of Zhongli (TW)

Hao-Cheng Hou of Hsinchu (TW)

Hung-Jen Lin of Tainan (TW)

Jung Wei Cheng of Hsinchu (TW)

Tsung-Ding Wang of Tainan (TW)

Yu-Min Liang of Zhongli (TW)

Li-Wei Chou of Taoyuan (TW)

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240379535 titled 'SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

Simplified Explanation: This semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip, a redistribution structure, an underfill, and a molding compound.

• The semiconductor package consists of multiple layers, including a first redistribution layer, a second redistribution layer, and a third redistribution layer with varying thicknesses.
• An underfill is placed between the bare semiconductor chip and the redistribution structure to provide support.
• A molding compound encapsulates the entire package for protection.

Key Features and Innovation:

• Multi-layer redistribution structure for enhanced connectivity.
• Underfill for structural support.
• Molding compound for encapsulation and protection.

Potential Applications:

• Integrated circuits
• Microelectronics
• Consumer electronics

Problems Solved:

• Improved connectivity between semiconductor chips.
• Enhanced structural support for fragile components.
• Protection from external elements.

Benefits:

• Increased reliability and durability.
• Enhanced performance.
• Extended lifespan of semiconductor devices.

Commercial Applications: The technology can be utilized in the manufacturing of various electronic devices, such as smartphones, tablets, and computers, to improve connectivity and overall performance.

Prior Art: Readers can explore prior patents related to semiconductor packaging and redistribution structures to understand the evolution of this technology.

Frequently Updated Research: Stay updated on advancements in semiconductor packaging technology and materials to enhance the performance and reliability of electronic devices.

Questions about Semiconductor Packaging: 1. What are the key components of a semiconductor package? 2. How does the redistribution structure improve connectivity in semiconductor devices?

Original Abstract Submitted

an embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. the redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. the third redistribution layer has a third thickness greater than the first thickness and the second thickness. the package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.