Taiwan semiconductor manufacturing company, ltd. (20240379517). WAFER BONDING INCORPORATING THERMAL CONDUCTIVE PATHS simplified abstract
Contents
WAFER BONDING INCORPORATING THERMAL CONDUCTIVE PATHS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Su-Jen Sung of Zhubei City (TW)
WAFER BONDING INCORPORATING THERMAL CONDUCTIVE PATHS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240379517 titled 'WAFER BONDING INCORPORATING THERMAL CONDUCTIVE PATHS
The method described in the patent application involves the formation of thermal conductive channels in bond layers on two separate wafers, with different thermal conductivity values, to facilitate heat transfer between the wafers. The wafers are then bonded together, allowing the thermal conductive channels to physically contact each other. An interconnect structure is formed over one of the wafers, which is electrically connected to integrated circuit devices in that wafer.
- Formation of thermal conductive channels in bond layers on two wafers
- Different thermal conductivity values for the channels compared to the bond layers
- Bonding of the two wafers with the thermal conductive channels in contact
- Formation of an interconnect structure over one of the wafers
- Electrical connection to integrated circuit devices in the wafer
Potential Applications: - Semiconductor manufacturing - Microelectronics - Thermal management systems
Problems Solved: - Improved heat dissipation between bonded wafers - Enhanced thermal conductivity in electronic devices
Benefits: - Increased efficiency in heat transfer - Better performance and reliability of integrated circuits
Commercial Applications: Title: Advanced Thermal Management Solutions for Semiconductor Industry This technology can be utilized in the production of high-performance electronic devices, such as smartphones, computers, and automotive electronics, to improve thermal management and overall device performance.
Questions about the technology: 1. How does the different thermal conductivity values in the thermal conductive channels and bond layers impact heat transfer efficiency? 2. What are the potential cost savings associated with implementing this thermal management technology in semiconductor manufacturing processes?
Frequently Updated Research: Ongoing research in the field of thermal management in electronic devices focuses on developing novel materials and structures to enhance heat dissipation and improve overall device performance. Stay updated on the latest advancements in this area to leverage cutting-edge technologies for your applications.
Original Abstract Submitted
a method includes forming a first bond layer on a first wafer, and forming a first thermal conductive channel extending into the first bond layer. the first thermal conductive channel has a first thermal conductivity value higher than a second thermal conductivity value of the first bond layer. the method further includes forming a second bond layer on a second wafer, and forming a second thermal conductive channel extending into the second bond layer. the second thermal conductive channel has a third thermal conductivity value higher than a fourth thermal conductivity value of the second bond layer. the first wafer is bonded to the second wafer, and the first thermal conductive channel at least physically contacts the second thermal conductive channel. an interconnect structure is formed over the first wafer. the interconnect structure is electrically connected to integrated circuit devices in the first wafer.
